MSCI is a high-tech enterprise focused on the R&D, manufacture and sales of semiconductor specialized equipment. The core team members with more than twenty-year experience in semiconductor equipment research and development, come from various well-known brands in the industry. The main products include IC-level advanced packaging flip-chip bonder, 3D stacking die bonder, 8/12-inch single and dual bond-head epoxy, soft solder die bonder, wafer level die bonder, etc.