MSCl is a high-tech enterprise focused on the R&D, manufacture and sales of semiconductor specialized equipment, bases in Anji, Nanjing, Wuxi, Shenzhen, Xi'an, Singapore and Penang Malaysia, and with R&D center in Singapore. Our die bonders range from conventional 8"/12" epoxy, automotive grade soft solder, flip-chip to advanced 3D stacking. Ultra high-precision TCB is in development for the solutions of TSV/TGV, We've acquired over one hundred IP. Also, we've obtained the ISOs and CE certificate, and won the honors of Technology-based SMEs, Specialized and Sophisticated SMEs, Key-supported Specialized and Sophisticated SMEs, provincial and municipal R&D center, First Units (Sets) , New Industrial Products and so on.