High-precision Soft Solder Die Bonder
MSC-H812SD
12-INCH SOFT SOLDER DIE BONDER
Features
- Linear motor driven bond head
- Accurate pick/bond force control
- Dual wire soldering
- 8-temperature zone
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±3°@ 3σ
- X/Y accuracy： ±35μm @ 3σ
Options
- Auto wafer load/unload
Application
- TO-252,TO220,TO247,TO263,PDFN