High-precision Filp Chip Bonder
MSC-H812FC
12-INCH HIGH-PRECISION FLIP CHIP BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- Flux dipping
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±0.5°@ 3σ
- X/Y accuracy：±5μm@ High Accuracy Mode, ±10μm @ 3σ
Options
- Auto wafer load/unload
- HEPA filter
Application
- FC-QFN/BGA