High-precision Filp Chip Bonder
MSC-H819FC
12-INCH HIGH-PRECISION FLIP CHIP BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- Flux dipping
- Wafer/Strip Mapping
- SECS/GEM
- Size Capability: 0.4x0.4~10x10mm
L x W x H
- 2,300x1,480x1,550 mm
Accuracy
- Angle accuracy： ±0.05°@ 3σ
- X/Y accuracy：±8μm @ 3σ
Options
- Auto wafer load/unload
- HEPA filter
Application
- FC-QFN,BGA,LGA