MSC-H912FC Super

MSC-H912FC Super

12-INCH ULTRA-PRECISION FLIP CHIP BONDER

Features

Linear motor driven dispensing/bond head
High-precision bond
Accurate pick/bond force control
Flux dipping
Wafer/Strip Mapping
SECS/GEM
Whole marble machine table
High-precision air flotation bond head
X-ray inspection

L x W x H

2,200x1,450x1,450 mm

Accuracy

Local accuracy： 3μm@ 3σ
Global accuracy (FO-WLP)： 5μm @ 3σ

Options

Auto wafer load/unload
HEPA filter

Application

FOWLP, FC-BGA, C2W, C2S, HAFC, TSV, TGV