3D Stacking Die Bonder
MSC-H8123D
12-INCH ADVANCED HIGH-PRECISION STACK DIE BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- DAF
- 25μm thin die
- 32-Hi stacking
- Class 100
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±0.5°@ 3σ
- X/Y accuracy： ±5μm @ 3σ
Options
- Auto wafer load/unload
- Adhesive level sensor
- HEPA filter
Application
- BGA, QFP, QFN, Memory chip, SIP