Die Bonder
MSC-812S
12-INCH SINGLE-BOND HEAD EPOXY DIE BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±2°@ 3σ
- X/Y accuracy： ±25.4μm @ 3σ
Options
- Adhesive level sensor
- HEPA filter
- DAF
Application
- SOT, SOP, D/QFN