Die Bonder
MSC-H812S
12-INCH SINGLE-BOND HEAD HIGH-PRECISION EPOXY DIE BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- DAF/UP-LOOK/UP-DOWN
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±1°@ 3σ
- X/Y accuracy： ±(10-24.5)μm @ 3σ
Options
- Auto wafer load/unload
- Adhesive level sensor
- HEPA filter
Application
- D/QFN, LGA,Stack Die