Die Bonder
MSC-88D
8-INCH DUAL-BOND HEAD EPOXY DIE BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- Dual BH
- Wafer/Strip Mapping
- SECS/GEM
L x W x H
- 1,950x1,550x2,000 mm
Accuracy
- Angle accuracy： ±2°@ 3σ
- X/Y accuracy： ±25.4μm @ 3σ
Options
- Adhesive level sensor
- HEPA filter
- Single-BH and dual-BH exchangeable
Application
- SOT, SOP, D/QFN