High-precision Die Bonder
MSC-H912SV
12-INCH ULTRA-PRECISION EPOXY DIE BONDER
Features
- Linear motor driven dispensing/bond head
- High-precision bond
- Accurate pick/bond force control
- Dual dispensing
- DAF/UP-LOOK/UP-DOWN
- Wafer/Strip Mapping
- SECS/GEM
- Capable to process roughing L/F
- Small die capability
L x W x H
- 2,200x1,450x1,450 mm
Accuracy
- Angle accuracy： ±0.5°@ 3σ
- X/Y accuracy： ±(7.5-10)μm @ 3σ
Options
- Auto wafer load/unload
- Adhesive level sensor
- HEPA filter
- Big bond force control
- 3 steps
- Large die capability
- Ni-Pd Leadframe
- Brown anodized leadframe
Application
- QFN, LGA, MEMS, Stack Die